Product Technology Overview
IPM in the Power Semiconductor Devices family. High Voltage and High Current Power Control Devices. Including MOSFETs, IGBTs, power diodes, and power modules featuring low power loss, high-speed switching capability, and optimized thermal performance. ChipNobo documents technology, parameters, and application fit before commercial steps.
Key Features
- Package options for design fit DIP-IPM package with series coverage for layout flexibility.
- Verified electrical window Vce(sat) 1.7 V
- Application-ready compliance RoHS / REACH and category-relevant qualification where applicable.
- Lifecycle status: Active Status visible up front so OEM teams can plan continuity.
Technical Parameters
| Product Family | CN-IPM |
|---|---|
| Category | IPM |
| Package | DIP-IPM |
| Tier | Mainstream |
| Voltage Rating | 1200 Vces |
| Current Rating | 50 A |
| Power Rating | 200 W |
| Operating Temperature | -40°C ~ +125°C |
| Core Spec | Vce(sat) 1.7 V |
| Compliance | RoHS, REACH, AEC-Q101, ISO 26262 |
| Lifecycle | Active |
Typical Applications
- Motor drives & inverters
- EV / energy conversion
- Industrial power stages
Compatibility Solutions
Supporting engineers with verified compatible alternatives and second-source solutions — through structural, electrical, and application analysis.
CID
Pin-to-Pin compatible candidates where package and electrical windows align.
COMPID
Engineering-compatible options with FAE evaluation support.
Lifecycle Support
Semiconductor Supply Continuity — plan beyond a single SKU when NRND, EOL, or shortage risk appears.
- Alternative Source
- Pin-to-Pin Replacement
- Long-Term Availability
Product Selection
Compare series options in this category, then refine with the family parametric filter.